Uses in Semiconductor / Crystal Display / Battery Industries

Recommended Model

TD Series

TD Series

  • Ultimate Pressure: 4 ~ 0.7 Pa
  • Exhaust Speed: 650 ~ 3,000 L/min

Product Catalogue (PDF)

BEH Series

BEH Series

  • Ultimate Pressure: 0.13 ~ 0.08 Pa
  • Exhaust Speed: 4,500 ~ 60,000 L/min

Product Catalogue (PDF)

Example of Use

Thin Film Forming Device Thin film forming device utilizes the features of vacuum condition and the reactions taking place in vacuum condition to form and process thin films. This device is used for production of optical lens, film-forming and -processing of silicon wafer, and forming of micro electro mechanical systems (MEMS) and solar cell. Currently, thin film forming device is the most widely used vacuum device.
Etching Machine Etching machine utilizes chemical liquids, reactive gases, and chemical reactions of ions to intentionally cause, in etching process, the chemical corrosion.
Ashing Machine Ashing machine is used for decomposing and removing photoresists in resist stripping process, and heating and combusting the objects.
Coater
Developer
Coater applies photosensitive material on wafers and developer fixes the transferred images on the wafer. Vacuum pump is used for vacuum-drying the extra solvent after photoresist is applied on the wafer.
Lithium Ion Battery Vacuum pump is used for cell-forming, electrode-drying, and electrolyte filling steps.

Contact

Contact Us